Product
Standard Leadframe Type
Basic configuration
Leadframe + PLAPACS® resin
Basic package types
DIP, SOP, QFP, SON, QFN, QFJ
Features
- High cost performance
- High humidity resistance by PLAPACS® resin
- High precision and high quality by transfer mold
Multilayer PCB Type
Basic configuration
PCB + PLAPACS® resin
Basic package types
LGA, PLCC
Features
- Highly flexible wiring design
- Suitable for multi-terminal high-performance device
- Low initial cost
Special Exclusive Design
Basic configuration
Exclusive design and production which satisfy specifications requested
Basic package types
Special structure, special shape
Features
Use of PLAPACS® resin in new fields
Focusing on ultra-precision processing technology, we are developing four businesses: semiconductor assembly business, plastic molding business, equipment business, and automotive parts business. Our strength is that we can develop new products that combine each other's technologies and build highly efficient production lines using our unique technologies while developing our business independently.