Package Information
Gull Wing Type
| Package Type | Package | Pin | Package Size(mm) | Pin Pitch (mm) |
||
| E | D | A | ||||
| SOP | SOP-8 | 8 | 3.90 | 4.89 | 1.73 | 1.27 |
| SOP-14 | 14 | 5.50 | 10.06 | 2.20 | 1.27 | |
| SOP-16 | 16 | 5.50 | 10.06 | 2.20 | 1.27 | |
| SOP-20 | 20 | 5.50 | 12.60 | 2.20 | 1.27 | |
| SOP-26 | 26 | 11.4 | 31.9 | 2.15 | 2.0 | |
| SOP-28 | 28 | 8.40 | 18.00 | 2.50 | 1.27 | |
| TSSOP | TSSOP-8 | 8 | 4.40 | 3.00 | 1.10 | 0.50 |
| TSSOP-14 | 14 | 4.40 | 5.00 | 1.10 | 0.65 | |
| TSSOP-16 | 16 | 4.40 | 5.00 | 1.10 | 0.65 | |
| TSSOP-20 | 20 | 4.40 | 6.50 | 1.10 | 0.65 | |
| TSSOP-24 | 24 | 4.40 | 7.80 | 1.10 | 0.65 | |
| TSSOP-48 | 48 | 6.10 | 12.50 | 1.20 | 0.50 | |
| LQFP | LQFP0707-48 | 48 | 7.00 | 7.00 | 1.70 | 0.50 |
Leadless Type
| Package Type | Molding | Package | Pin | Package Size(mm) | Pin Pitch (mm) |
||
| E | D | A | |||||
| SON ※ | MAP | SON025020 | 8 | 2.50 | 2.00 | 0.50 | 0.50 |
| SON025025 | 8 | 2.50 | 2.50 | 0.50 | 0.50 | ||
| SON030030 | 3.00 | 3.00 | 0.50 | 0.50 | |||
| SON035035 | 3.50 | 3.50 | 0.50 | 0.50 | |||
| SON040040 | 4.00 | 4.00 | 0.50 | 0.50 | |||
| SON045045 | 4.50 | 4.50 | 0.50 | 0.50 | |||
| SON050050 | 8 | 5.00 | 5.00 | 0.50 | 0.80 | ||
| QFN ※ | MAP | QFN025020 | 2.50 | 2.00 | 0.65 | 0.50 | |
| QFN025025 | 2.50 | 2.50 | 0.65 | 0.50 | |||
| QFN030030 | 3.00 | 3.00 | 0.65 | 0.50 | |||
| QFN035035 | 3.50 | 3.50 | 0.65 | 0.50 | |||
| QFN040040 | 20 | 4.00 | 4.00 | 0.65 | 0.50 | ||
| QFN045045 | 4.50 | 4.50 | 0.65 | 0.50 | |||
| QFN050050 | 5.00 | 5.00 | 0.65 | 0.50 | |||
| Discrete | QFN0404 | 20 | 4.00 | 4.00 | 0.95 | 0.50 | |
※It is possible to respond to each size (miniaturized) by MAP specification
※Flexible support for SON and QFN exposed pad sizes
Wettable Flank Type
PCB Type
| Package Type | Package | Ball | Package Size(mm) | Ball Pitch (mm) |
|
| E | D | ||||
| BGA ※ | BGA031036 | 42 | 3.10 | 3.60 | 0.40 |
| BGA050050 | 57 | 5.00 | 5.00 | 0.50 | |
| BGA050050 | 64 | 5.00 | 5.00 | 0.50 | |
| BGA050050 | 41 | 5.00 | 5.00 | 0.65 | |
| BGA060060 | 85 | 6.00 | 6.00 | 0.50 | |
| BGA070070 | 212 | 7.00 | 7.00 | 0.40 | |
| BGA070070 | 113 | 7.00 | 7.00 | 0.50 | |
| BGA070070 | 80 | 7.00 | 7.00 | 0.65 | |
| BGA080080 | 176 | 8.00 | 8.00 | 0.50 | |
| BGA080080 | 96 | 8.00 | 8.00 | 0.65 | |
| BGA090090 | 9.00 | 9.00 | 0.50 | ||
| BGA1010 | 121 | 10.00 | 10.00 | 0.50 | |
※ BGA compact type is also available
（size E / D dimension = 3.0 mm etc.）
Pin Insertion Type
| Package Type | Package | pin | Package Size(mm) | Pin Pitch (mm) |
||
| E | D | A | ||||
| DIP | DIP26 | 26 | 11.4 | 31.9 | 2.15 | 2.0 |
Focusing on ultra-precision processing technology, we are developing four businesses: semiconductor assembly business, plastic molding business, equipment business, and automotive parts business. Our strength is that we can develop new products that combine each other's technologies and build highly efficient production lines using our unique technologies while developing our business independently.